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1. Toshiba, New Polymeric Multilayer and Packaging, Proceedings of the Printed Circuit World Conference V, Glasgow, Scotland, January 1991. 2. The Institute for Interconnecting and Packaging Electronic Circuits, 7380 N. Lincoln Ave, Lincolnwood, IL 60646. 3. IPC-SM-782, Surface Mount Design and Land Pattern Standard, The Institute for Interconnecting and Packaging Electronic Circuits. 4. Y. Tsukada et al., A Novel Solution for MCM-L Utilizing Surface Laminar Circuit and Flip Chip Attach Technology, Proceedings of the 2d International Conference on Multichip Modules, Denver, CO, April 1993, pp. 252 259.

RS-232 port and hence expected to be not so stable, this did not seem a feasible processor to use I then decided to use the AT90S2323, which is very much like the AT90S2343 except that it requires an external crystal The AT90S2323 has 128 bytes of internal SRAM but no built-in UART (serial port) So it was decided to create a software-driven serial port Figure 177 illustrates the circuit schematic for the frequency counter The power to the circuit is derived out of the RTS signal of the PC RS-232 port Diode D1, resistor R2, and zener Z1 generate the required supply voltage The diode is 1N4148 signal diode and is used to ensure that only positive voltage is applied to the circuit Zener Z1 is selected to be 51 V and R2 is 470 ohm to limit the current into the zener diode.

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Solder Flux Some of the fluxes in use for tin-lead soldering may not be compatible with the higher reflow temperatures associated with most Pb-free alloys. Critical materials in the flux may boil off, decompose, or oxidize before thorough fluxing can take place. Also, the flux must remain on metal surfaces to be bonded until reflow occurs since it serves as an oxygen barrier. Were the flux to disappear too soon, reoxidation of the solder and bonding surfaces may occur, which will retard solder wetting. Fluxes for Pb-free solders must be tailored to the composition of the new solder alloys and their inherently higher soldering process temperatures, and to the Pb-free surface finishes on component leads and PWB bonding pads.

Hygiene Distinct health benefits are associated with the removal of Pb from printed circuit assemblies. Pb s toxicity is well documented, and the most serious problems are associated with direct ingestion of Pb-bearing materials (for example, children ingesting peeling Pb-based paint or lead in drinking water from Pb-soldered plumbing). This accumulating heavy metal dissolves slowly in the human body. Although there is conflicting evidence as to whether Pb from solder can leach into the water table from landfills at a rate that warrants concern, it is in everyone s best interest to explore alternative solder alloys and migrate from Pb-based solders. Printed circuit board assembly operations will certainly benefit in that the labor force will encounter lower toxicity. Solder dross generated during wave soldering or disturbed while performing wave solder maintenance is a major source of Pb inhalation in manufacturing plants. Airborne dross is also generated at solder fountain operations, hot-air rework, and even during hand soldering. The move to a Pb-free environment will also eliminate concerns for ingested fines from Pb-contaminated hands.

146 Lead Replacement Cost In the United States and other countries, some legislative initiatives aimed at restricting the use of Pb have failed This failure spurred research for solder replacement alloys Several corporations and universities devised Pb-free solders, some of which were patented As is the case with any patented item or process, the rights to invention reside with the inventor or sponsoring corporation in the short term, and several of these alloys may not be used freely In some cases, only slight modifications in alloy composition separate commonly available solder alloys from patented solder compositions The cost of patent licensing, whether by the end user or solder manufacturer, will be borne largely by the end user In almost every case, the cost of Pb-free solder is at minimum 20 percent higher than for Sn-Pb solder PWB laminates are more costly, as are many of the components.

Precision EDM, electrolytic polishing, line cutting or grinding, photolithography (visible light), electron beam machining, laser machining Mirror surface cutting (grinding), vacuum deposition, precision lapping, chemical vapor deposition (CVD), photolithography (ultra-violet rays) single-point diamond cutting

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